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Film forming equipment Product List and Ranking from 33 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Aug 06, 2025~Sep 02, 2025
This ranking is based on the number of page views on our site.

Film forming equipment Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Aug 06, 2025~Sep 02, 2025
This ranking is based on the number of page views on our site.

  1. 日本エバテック Osaka//Electronic Components and Semiconductors
  2. 京浜ラムテック Kanagawa//Manufacturing and processing contract
  3. 栗田製作所 Kyoto//Industrial Electrical Equipment 本社・京都事業部
  4. 4 マツボー Tokyo//Trading company/Wholesale
  5. 4 JSWアフティ Tokyo//Electronic Components and Semiconductors

Film forming equipment Product ranking

Last Updated: Aggregation Period:Aug 06, 2025~Sep 02, 2025
This ranking is based on the number of page views on our site.

  1. RAM cluster-type sputtering deposition device 京浜ラムテック
  2. High Rate Ion Beam Sputtering High-Speed Film Deposition System (HR-PVD) ティー・ケイ・エス
  3. High-speed wafer deposition equipment HEXAGON 日本エバテック
  4. 4 Pulse Laser Film Formation Device "GLAZE Series" ハイテック・システムズ
  5. 4 ECR plasma deposition device "AFTEX-6000 series" JSWアフティ

Film forming equipment Product List

1~15 item / All 67 items

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Management of oxide layers on metal surfaces

Quantitative management is possible within the processes of natural oxidation layers and forced heating oxidation layers.

Quantitative management of natural oxide layers and forced heating oxide layers in processes involving copper alloys, aluminum alloys, lead frame materials, and Ni plating is possible. Corona surf is used for managing surface cleanliness and surface quality in various industrial fields. For more details, please download the catalog.

  • Surface treatment contract service

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Glass Substrate Deposition System “Low Temperature Deposition” “Flexible Substrate Support”

4.5 generation glass substrate deposition system for rigid/flexible devices such as FPD.

4.5 generation glass substrate deposition system for rigid/flexible devices such as FPD. 【Features】  ・Low temperature (150-300 degrees C) deposition  ・Deposition of 100 nm SiO2 film on 4.5 generation glass substrates at 250 degrees C with a throughput of 25 wafers/hour or more  ・Simple maintenance  ・Low CoO (low running cost)  ・High-quality SiO2 deposition formation: low stress, no plasma damage, small particles  ・Low installation and maintenance cost: small footprint, no need for vacuum or plasma     treatment 【Applications】  ・Insulating deposition for FPD (NSG)  ・Oxide semiconductor TFT passivation deposition (NSG) *For more details, please contact us or download the catalog to view.

  • CVD Equipment

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Plasma Ion Injection Film Formation Device

This is a completely new DLC coating device from Japan that also allows for gas ion injection.

- It is easy to manufacture large vacuum devices, and we have a track record of delivering large devices with a maximum length of 4m and a diameter of 1.2m. - Cost reduction is possible due to fully automated operation. - In addition to DLC film deposition, simple ion implantation is also possible, enabling the development of new materials. - Since a rotation and revolution mechanism and heater are not required, it is possible to minimize the generation of particles within the vacuum device.

  • Plasma Generator
  • CVD Equipment
  • Plasma surface treatment equipment

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DLC film deposition device "Plasma Ion Injection Film Deposition Device"

3D, large-scale, low-temperature processing possible! Plasma ion implantation film deposition device using proprietary development technology.

The "Plasma Ion Injection Film Deposition Device" employs proprietary technology and is a DLC film deposition device capable of three-dimensional, large-scale, and low-temperature processing. It is a uniquely developed device by Kurita Seisakusho and has obtained a patent (Patent No. 3555928). By supplying the output of the pulse RF power source for plasma generation and the high-voltage pulse power source for ion injection from a single electrode, it enables plasma generation tailored to the substrate shape. DLC coating and gas ion injection processing can be performed with this single device. 【Features】 - Capable of three-dimensional shape film deposition - Can accommodate larger devices - Capable of low-temperature processing - Fully automated operation - Reliable log function For more details, please contact us or download the catalog.

  • Plasma surface treatment equipment

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[Application Example] Pulsed Laser Deposition (PLD)

Our unique high-output excimer laser! Achieving long operating hours and long lifespan.

Our powerful excimer laser for pulsed laser deposition (PLD) enables rapid and gentle deposition at throughput speeds, supporting both research and mass production. By using a robust COMPex laser, it is possible to achieve stoichiometrically superior results in pulsed laser deposition (PLD). The high-output LEAP laser enables a wide range of high-performance thin films, and the excimer laser ensures long operating times and longevity. [Product Lineup] ■COMPEX ■LEAP ■LAMBDA SX *For more details, please refer to the related links or feel free to contact us.

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  • solutions-me-pld-rf-piezo-filters.jpg
  • solutions-me-pld-dlc-layers.jpg
  • solutions-me-pld-thin-film-wafers.jpg
  • solutions-me-pld-thin-film-batteries.jpg
  • Laser Components

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Dual Ion Beam Deposition System

Dual Ion Beam Deposition System

Scia Systems GmbH was established by key staff who developed the software and hard wafers for the ion beam trimming (trimming processing, IBF) device IonScan from Roth&Rau AG and MicroSystems GmbH. Scia Systems develops unique and proprietary cutting-edge ion beam and plasma technologies, handling equipment from research and development to mass production.

  • Other processing machines

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Roll to Roll device "ATMOS-R2R Series"

Can be installed in the same chamber! Reduces cross-contamination through multi-zone configuration.

The "ATMOS-R2R Series" is a roll-to-roll device. It performs surface treatment and film formation on various types of flexible films, reducing cross-contamination through multi-zone configuration within the same chamber. Various deposition sources and treatment sources can be installed in the same chamber, providing high compatibility through the integration of the FLOCON series gas, vapor, and liquid control systems. 【Features】 ■ Surface treatment and film formation on various types of flexible films ■ Reduction of cross-contamination through multi-zone configuration within the same chamber *For more details, please refer to the PDF document or feel free to contact us.

  • Other surface treatment equipment

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Pulse Laser Film Formation Device "GLAZE Series"

Substrate heating above 800℃ and reactive film formation are possible! A pulsed laser deposition system that enables high-efficiency and high-quality film formation.

The "GLAZE Series" is a state-of-the-art pulsed laser deposition system for thin film formation. It enables high-efficiency and high-quality film deposition through a hybrid process. It allows for substrate heating above 800°C and reactive film deposition, and it can also be equipped with a magnetron cathode. 【Features】 ■ State-of-the-art pulsed laser deposition system for thin film formation ■ High-efficiency and high-quality film deposition through a hybrid process ■ Substrate heating above 800°C and reactive film deposition possible ■ Magnetron cathode can also be installed *For more details, please refer to the PDF document or feel free to contact us.

  • Laser marker

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Hot Filament CVD Film Deposition Device MPHF

It is a compact tabletop CVD surface treatment device equipped with a hot filament (hot wire).

The W filament installed near the sample can be heated up to 2000°C, promoting the decomposition of various reaction gases. The active species (radicals) generated by gas decomposition accumulate on the sample surface to form a film.

  • Other processing machines

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Organic EL film formation device

Film-forming device for organic material development

**Features** - Capable of transporting masks and samples using a transport mechanism. - Organic and metal materials can be deposited in the same chamber. - Co-evaporation of organic and metal materials is possible. - Co-evaporation of organic materials is possible (up to 4 components). - Standard water-cooled jacket to prevent contamination between organic and metal materials. - In the deposition chamber, substrates and masks can be exchanged under vacuum conditions. - The gap between the substrate and the mask is minimized. - The substrate rotation mechanism ensures film thickness uniformity within ±5% across the surface. - The organic deposition cell has excellent directionality, resulting in minimal material contamination in the deposition chamber. - Each processing chamber is treated with a special surface treatment for rapid attainment of the operating vacuum pressure. - Can be connected to a glove box. - Automatic transport and exhaust are possible with PLC control. - The introduction chamber can stock a standard of 5 substrate and mask holders.

  • power supply
  • Organic Natural Materials
  • Other optical parts

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Organic EL film formation device

This is a research and development device equipped with an inline automatic control function for organic EL.

Eight organic vapor deposition cells (KOD-Cell) for organic materials (organic EL) are equipped, and a metal vapor deposition cell is standard for metal material deposition. Both the organic and metal cells are configured with a small-sized crucible to minimize chamber contamination within the device chamber. This system is fully automated, making it a multipurpose research and development device capable of conducting a wide variety of research.

  • Evaporation Equipment
  • Organic EL
  • Other clean room equipment and facilities

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Organic EL film formation device

This is an experimental device for organic EL. The operation of the transport system can be controlled from a PC. It is the completed form of a fully automatic cluster-type film deposition device.

Sixteen organic evaporation cells (KOD-Cell) for organic EL film formation are equipped, and a metal evaporation cell is standard for metal material deposition. Both the organic and metal cells are configured with small-sized crucibles to minimize chamber contamination within the device chamber. This system is fully automated, making it a multipurpose research and development device capable of conducting a wide variety of research.

  • Evaporation Equipment
  • Organic EL
  • Other clean room equipment and facilities

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Film Continuous Deposition Device

Film Continuous Deposition Device

Device for continuously forming films from roll-shaped film ■□■Features■□■ ■Compatible with sputtering, EB, and resistance heating deposition ■Tension pickup feedback control ■Cold trap for film release gas exhaust ■Differential exhaust system (optional installation) ■Substrate cleaning mechanism ■Resistance value transmittance monitoring mechanism ■Deposition roller cooling refrigerant system ■Supports continuous film formation on both sides (see image on the right) ■Roll width, roll diameter, and winding speed are negotiable ■Winding control with independent control of UW, W, and CR ■For custom-made semiconductor manufacturing equipment, scientific instruments, and accessories, please leave it to us. For details, please contact us.

  • Other semiconductor manufacturing equipment

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Corrosion resistance measures using DLC <STD-DLC>

We will deposit a DLC with excellent corrosion resistance and almost no pinholes using a thick film.

Our method allows for the deposition of DLC with low internal stress. As a result, thick DLC films can be deposited, which are resistant to most acids and alkalis. We can also deposit on complex shapes and the inner surfaces of pipes, which is difficult for other companies.

  • Surface treatment contract service

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